1/4 rev. b structure silicon monolit hic integrated circuits product series 2-in-1 motor driver for vtr type bd6904fp function ? vtr cylinder motor driver (sensorless 3-phas e full-wave soft switching drive system) ? vtr loading motor driver absolute maximum ratings (ta=25 ) parameter symbol limit unit supply voltage vcc 7 v vm 15 v vg 20 v power dissipation pd 1450 1 mw operating temperature range topr -20 +75 storage temperature range ts t g -55 +150 maximum output current ( cylinder block ) iomax1 800 2 ma maximum output current ( loading block ) iomax2 800 2 ma junction temperature tjmax +150 1 90mm 90mm 1.6mm glass epoxy board. derating in done at 11.6mw/ for operating above ta=25 . 2 do not, however exceed pd, aso and tjmax=150 . recommended operating conditions (ta= -25 +75 ) parameter symbol min typ max unit supply voltage vcc 4.5 5 5.5 v vm 9 12 14 v vg vm+2 17 19 v com input in-phase voltage range vcomd 0 - vm-2.5 v pg amp in-phase input voltage range vpd 1.5 - 3.7 v this product described in this specification isn?t judged whether it applies to cocom regulations. please confirm in case of export. this product isn?t designed for prot ection against radioactive rays.
2/4 rev. b electrical characteristics (unl ess otherwise specified, ta=25 , vcc=5v, vm1=vm2=12v, vg=17v) parameter symbol limit unit conditions min. typ. max. overall vcc total supply current icc - 9 13 ma output high-side output saturation voltage voh - 0.4 0.7 v io=-300ma low-side output saturation voltage vol - 0.55 0.85 v io=300ma bemf comparator bemf comparator hysteresis width + vhysb+ +24 +36 +48 mv bemf comparator hysteresis width - vhysb- -59 -43 -27 mv torque reference torque reference start voltage vecr 2.35 2.5 2.65 v torque reference i/o gain gio 0.80 1.06 1.33 a/v ec=2.3v-2.2v gain output (hlm) rrnf=0.68 ? current limit voltage vcl 239 295 345 mv rrnf=0.68 soft switch ct1, ct2 charge current ictd -53 -39 -25 a ct1, ct2 discharge current icti 29 45 61 a high ct1, ct2 clamp voltage vcth 3.4 3.8 4.2 v low ct1, ct2 clamp voltage vctl 0.85 1.05 1.25 v startup control logic cst charge current icsto -20 -14 -8 a cst discharge current icsti 2 5.5 9 a high cst clamp voltage vcsth 2.4 2.8 3.2 v low cst clamp voltage vcstl 0.8 1.0 1.2 v cst off voltage vcsto 3.6 3.8 4.0 v pg amp input bias current ipg- - 1 3 a pg-=2.5v input offset voltage viop -8 - +8 mv dc bias voltage vbp 2.25 2.5 2.75 v voltage gain 1 av1 50 71 - db f=1khz high output voltage vohp 3.4 3.75 - v ioh=-1ma low output voltage volp - 1.2 1.6 v iol=1ma pfg output pg detection level vpgth vbp-0.075 vbp-0.1 vbp-0.125 v high output voltage vpfgh 3.5 - - v io=-30 a middle output voltage vpfgm 2.1 - 2.9 v io= 10 a low output voltage vpfgl - - 0.9 v io=30 a loading high-level fin input vfinh 3.5 - - v high-level rin input vrinh 3.5 - - v low-level fin input vfinl - - 1.5 v low-level rin input vrinl - - 1.5 v output saturation voltage vce - 0.3 0.6 v io=200ma, total of output transistor high-side and low-side voltage source currents are treated as negative while sinking currents are treated as positive.
3/4 rev. b package outline block diagram pin no. / pin name pin no. pin name 1 vm2 2 out1 3 lgnd 4 out2 5 fin 6 rin 7 vg 8 gnd 9 cst 10 ct1 11 ct2 12 pci 13 cnf 14 ec 15 pg+ 16 pg- 17 pgout 18 pfgout 19 vcc 20 com 21 vm1 22 u 23 v 24 rnf 25 w hsop-25 ( unit:mm ) bd6904fp lot no. drive si g nal selector pre-drive vm1 out2 out1 vcc lgnd pg fg synthesis startup control logic soft switch waveform tsd pre-drive control logic v u w rnf vg fin gnd pfgout pgout pg- cst ct1 ct2 ec cnf vcc low-side saturation prevention rin vm2 pg+ com pci err amp cs amp pg amp hysteresis comparator back emf detection comparator output product no.
4/4 rev. b operation notes (1) absolute maximum ratings use of the ic in excess of absolute maximum ratings such as the applied voltage or operating temperature range (topr) may result in ic damage. assumptions should not be made regardi ng the state of the ic (short mode or open mode) when such damage is suffered. the implementation of a physical safety m easure such as a fuse should be considered when use of the ic in a special mode where the absolute maxi mum ratings may be exceeded is anticipated. (2) power supply lines regenerated current may flow as a result of the motor's back el ectromotive force. insert capa citors between the power supply and ground pins to serve as a route for regenerated current. de termine the capacitance in full consideration of all the characteristics of the electrolytic capaci tor, because the electrolytic capacitor may loose some capacitance at low temperature s. if the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circ uitry may exceed the absolute maximum ratings. it is recommended to implement a physical safe ty measure such as the insertion of a voltage clamp diode between the power supply and gnd pins. (3) ground potential ensure a minimum gnd pin potenti al in all operating conditions. (4) setting of heat use a thermal design that allows for a sufficient margin in li ght of the power dissipation (pd) in actual operating conditions. (5) actions in strong magnetic field use caution when using the ic in the presence of a strong magnetic field as doi ng so may cause the ic to malfunction. (6) aso when using the ic, set the output transistor for the motor so that it does not exceed absolute maximum ratings or aso. (7) thermal shutdown circuit this ic incorporates a tsd (thermal s hutdown) circuit (tsd circuit). if the tem perature of the chip reaches the following temperature, the motor coil output will be opened.the thermal shutdo wn circuit (tsd circuit) is designed only to shut the ic of f to prevent runaway thermal operation. it is not designed to protec t the ic or guarantee its operation. do not continue to use t he ic after operating this circuit or use the ic in an envi ronment where the operation of this circuit is assumed. tsd on temperature [c] (typ.) hysteresis temperature [c] (typ.) 170 20 (8) ground wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal gr ound voltage. be careful not to change the gnd wiring pattern of any external components, either.
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